Wafer processing:

• Sputtering systems for thin metallic and non-metallic films.
• LPCVD systems for thin insulating films.
• Furnaces: PN diffusion / thermal oxidation / thermal treatments.
• Double side alignment/insolation.
• Photoresist spinner.
• RIE and DRIE dry etching systems.
• Chemical benches.
• Equipment for porosification and electropolishing.
• Electroplating.
• Nanoimprint lithography.

Characterisation, packaging and interconnection:

• Scanning optical electron microscope (SEM and STEM).
• Wire bonding.
• Die attach (adhesive, flip-chip, eutectic...).
• Rapid prototyping in FDM plastic (fusion deposition modelling) and by stereolithography.
• Testing equipment (wire bonding, chip substrate bonding).
• Thin film characterisation bench (reflectometer ellipsometer, sheet resistance, prism coupler).
• Contact and confocal profilometers.

Replication and microassembly:

• Microinjection.
• Micromachining - femtolaser and excimer laser.
• Micromachine-cutting.
• Microelectroerosion by wire and penetration.